Varian Systems
VARIAN 3180 VARIAN 3190 VARIAN 3290 VARIAN XM 2000
Varian 3180
First of the Cassette-to-cassette sputtering systems
from 1981. 4 processing stations. Maximum through
put of 45 wafers per hour. Can be fitted to handle wafers from 50 mm to 125
mm. Will run using 200, 208, 360 or 480, 3 phase
60 Hz power. The three
sputtering
power supplies are 12 KW each.
Varian 3190
Up-dated Cassette-to-cassette sputtering systems.
With an improved vacuum system, the maximum through
put is 60 wafers per hour.
Can be fitted to handle wafers from 50 mm to 125
mm. Will operate using 200, 208, 360 or 480, 3 phase
60 Hz power. The three sputtering power
supplies are 12 KW each. Options include RF
Etch, Biased heaters.
Varian 3290
A larger Cassette-to-cassette sputtering systems
that will handle 150 mm wafers with a of maximum
throughput of 60 wafers per
hour. 4 processing stations. Will operate using 200,
208, 360 or 480, 3 phase 60 Hz power. Many options
are available with this
system including two types of sputtering sources, RF
Etch with "VIP's", Biased heaters, Load Lock
Turbo-pump, recipe controlled
heaters and others.
First of the Cassette-to-cassette sputtering systems from 1981. 4 processing stations. Maximum through put of 45 wafers per hour. Can be fitted to handle wafers from 50 mm to 125 mm. Will run using 200, 208, 360 or 480, 3 phase 60 Hz power. The three sputtering power supplies are 12 KW each.
Varian 3190
Up-dated Cassette-to-cassette sputtering systems. With an improved vacuum system, the maximum through put is 60 wafers per hour. Can be fitted to handle wafers from 50 mm to 125 mm. Will operate using 200, 208, 360 or 480, 3 phase 60 Hz power. The three sputtering power supplies are 12 KW each. Options include RF Etch, Biased heaters.
Varian 3290
A larger Cassette-to-cassette sputtering systems that will handle 150 mm wafers with a of maximum throughput of 60 wafers per hour. 4 processing stations. Will operate using 200, 208, 360 or 480, 3 phase 60 Hz power. Many options are available with this system including two types of sputtering sources, RF Etch with "VIP's", Biased heaters, Load Lock Turbo-pump, recipe controlled heaters and others.
Varian
XM 2000
One of
the most versatile sputtering system available
today. An excellent tool for experimenting with
variousfilms, and can deposit such materials as;
aluminum, silicon, tantalum, copper, nickel,
titanium tungsten, platinum and more.Employs the individual wafer metallization concept, which is unsurpassed in
producing repeatable films run after run.
Thermal Evaporation Systems – there is probably a more advanced CPA version that is tested, proven and will give you more for
your money.
